MTU Library Catalogue

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Joining processes : an introduction / David Brandon and Wayne D. Kaplan.

By: Brandon, D. G.
Contributor(s): Kaplan, Wayne D.
Material type: materialTypeLabelBookPublisher: [Chichester] ; New York : Wiley, c1997Description: xiv, 363 p. : ill (some col.) ; 23 cm. + pbk.ISBN: 0471964875 (hbk); 0471964883 (pbk).Subject(s): Surfaces (Technology) | Sealing (Technology) | Welding | Joints (Engineering)DDC classification: 620.44
Contents:
Part I: Principles of joining -- Introduction -- Surface science -- The mechanics of joining -- Part II: Joining methods -- Mechanical bonding -- Welding -- Weld metallurgy -- Soldering & brazing -- Metal-ceramic joints & diffusion bonding -- Adhesives -- Part III: Applications of joining -- Vacuum seals -- Microelectronic packaging.
Holdings
Item type Current library Call number Copy number Status Barcode
General lending MTU Bishopstown Library Lending 620.44 (Browse shelf(Opens below)) 1 Available 00179652
General lending MTU Bishopstown Library Lending 620.44 (Browse shelf(Opens below)) 1 Available 00070727
Total holds: 0

Enhanced descriptions from Syndetics:

Joining Processes An Introduction David Brandon and Wayne D. Kaplan Technion, Israel Institute of Technology, Israel This is an introductory text for students of materials science and engineering interested in the scientific background to the joining and assembly of components in engineering systems. The principles of joining and the common methods employed to achieve a reliable joint are covered in chapters that all conclude with a summary of the points covered, and a set of problems for individual study, or class discussion. In the first chapters, thorough introductory overviews are given of firstly, the mechanical, chemical and physical phenomena related to surfaces, contacts and joins. In subsequent chapters, any necessary metallurgical or chemical background is adequately covered to enable students to understand the basic principles of a variety of joining methods, microelectronic devices and vacuum assemblies. Contents: Introduction; Surface Science; The Mechanics of Joining; Mechanical Bonding; Welding; Weld Metallurgy; Soldering and Brazing; Metal-ceramic Joints and Diffusion Bonding; Adhesives; Vacuum Seals; Micro-electronic Packaging.

Includes bibliographical references and index.

Part I: Principles of joining -- Introduction -- Surface science -- The mechanics of joining -- Part II: Joining methods -- Mechanical bonding -- Welding -- Weld metallurgy -- Soldering & brazing -- Metal-ceramic joints & diffusion bonding -- Adhesives -- Part III: Applications of joining -- Vacuum seals -- Microelectronic packaging.

Table of contents provided by Syndetics

  • Principles Of Joining
  • Surface Science
  • The Mechanics of Joining
  • Joining Methods
  • Mechanical Bonding
  • Welding
  • Weld Metallurgy
  • Soldering and Brazing
  • Metal-Ceramic Joints and Diffusion Bonding
  • Adhesives
  • Applications Of Joining
  • Vacuum Seals
  • Microelectronic Packaging
  • Index