Proceedings of the 49th electronic components and technology conference held in San Diego, California, June 1-4, 1999 / sponsored by the Components, Packaging and Manufacturing Technology Society of the IEEE and the Electronics Industries Alliance.
By: (49th : Electronic Components & Technology Conference (49th : 1999 : San Diego, California).
Contributor(s): Institute of Electrical and Electronics Engineers
| Electronic Industries Alliance.
Material type: 
BookPublisher: New Jersey : Institute of Electrical and Electronics Engineers, 1999Description: xxvii, 1269 p. : ill. ; 30 cm + pbk.ISBN: 0780352319.ISSN: 05695503.Subject(s): Electronic apparatus and appliances -- Congresses | Electronic industries -- CongressesDDC classification: 621.381 | Item type | Current library | Call number | Copy number | Status | Barcode | |
|---|---|---|---|---|---|---|
| General lending | MTU Bishopstown Library Lending | 621.381 (Browse shelf(Opens below)) | 1 | Available | 00085854 |
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Enhanced descriptions from Syndetics:
These conference papers present coverage of components and packaging science, technology and education. Topics range from components, connectors, and interconnections to single and multichip packaging and technology."
IEEE catalog no.99ch36299.
Includes bibliographical references and index.
Wavelength division multiplexing -- Recent advancements in underfill processing -- Embedded passive components -- Solder reliability -- Substrates/packaging -- Optoelectronic modules -- SCP & Flip-chip packages -- Flip chip/solders -- Modeling & simulation -- Electrically conductive adhesives -- Small-form-factor optical connectors -- Underfill assembly/advanced packages -- Interconnect bonding -- Interconnect electrical modeling & simulation -- Connectors -- Small-form-factor transceivers -- Flip-chip reliability -- Single-chip packaging -- Multichip packaging -- Plastic packaging -- Parallel optical interconnect -- Characterization of underfill -- Moisture sensitivity/delamination -- Package electrical modeling and simulation -- Electronics packaging education -- Opto-electronic packaging challenges -- Flip-chip combined underfill/flux materials -- Thermomechanical stress-modeling & simulation -- Components: circuits & reliability -- Electronics packaging education -- Wednesday poster session -- Thursday poster session.