MTU Library Catalogue

Syndetics cover image
Image from Syndetics

Common sense approach to thermal imaging / Gerald C. Holst.

By: Holst, Gerald C.
Material type: materialTypeLabelBookPublisher: Winter Park, Fl : Bellingham, Washington : JCD ; SPIE Optical Engineering Press, 2000Description: xiii, 377 p. : ill. ; 24 cm. + hbk.ISBN: 0964000075; 0819437220.Subject(s): Infrared imaging | Thermography | Imaging systemsDDC classification: 621.3672
Contents:
Introduction -- Heat -- Detection of radiation -- Emissivity -- Atmospheric transmittance -- Camera design -- Performance parameters -- Camera selection -- Observer training -- Introduction to applications -- Target signatures -- Temperature measurements -- Building envelope inspection -- Roof inspection -- Power distribution -- Electrical/mechanical inspection -- Buried objects -- Surveillance -- Nondestructive testing -- Process/quality control -- Inspection procedures.

Enhanced descriptions from Syndetics:

Researchers and scientists will focus on the first part of this book, which provides the physics background necessary to interpret thermograms; thermographers will concentrate on the applications-oriented second part (minimal math is required, except for the chapter on nondestructive testing). Among the applications addressed: inspections of roofs, buildings, and electrical and mechanical systems; power distribution; surveillance; nondestructive testing; and process control. Among the topics covered: heat capacity, heat transfer, emissivity, blackbody radiation, camera selection, performance parameters, temperature measurements, and camera designs. The author's affiliations are not stated. Annotation c. Book News, Inc., Portland, OR (booknews.com)

Includes bibliographical references and index.

Introduction -- Heat -- Detection of radiation -- Emissivity -- Atmospheric transmittance -- Camera design -- Performance parameters -- Camera selection -- Observer training -- Introduction to applications -- Target signatures -- Temperature measurements -- Building envelope inspection -- Roof inspection -- Power distribution -- Electrical/mechanical inspection -- Buried objects -- Surveillance -- Nondestructive testing -- Process/quality control -- Inspection procedures.

Table of contents provided by Syndetics

  • 1. Introduction (p. 1)
  • 1.1. Heat (p. 3)
  • 1.2. Temperature measuring devices (p. 4)
  • 1.2.1. Contact devices (p. 5)
  • 1.2.2. Non-contact devices (p. 7)
  • 1.3. Temperature scales (p. 9)
  • 1.4. The electromagnetic spectrum (p. 11)
  • 1.5. Brief history of thermography (p. 15)
  • 1.6. System development (p. 16)
  • 1.7. Applications overview (p. 18)
  • 1.8. Units (p. 19)
  • 1.9. References (p. 20)
  • 2. Heat (p. 21)
  • 2.1. Heat capacity and specific heat capacity (p. 23)
  • 2.2. Phase change (p. 24)
  • 2.3. Heat transfer (p. 27)
  • 2.3.1. Conduction (p. 27)
  • 2.3.2. Convection (p. 32)
  • 2.3.3. Radiation (p. 34)
  • 2.4. Heat sources (p. 35)
  • 2.4.1. Sun (p. 35)
  • 2.4.2. Combustion (p. 36)
  • 2.4.3. Chemical reaction (p. 38)
  • 2.4.4. Nuclear power plant (p. 38)
  • 2.4.5. Energy conversion (p. 39)
  • 2.4.6. Mass transport (p. 45)
  • 2.4.7. Man-made (p. 45)
  • 2.5. Useful conversions and constants (p. 46)
  • 2.6. References (p. 47)
  • 3. Detection of Radiation (p. 48)
  • 3.1. Stefan-Boltzmann law (p. 48)
  • 3.1.1. General response (p. 49)
  • 3.1.2. The background (p. 49)
  • 3.2. Planck's blackbody law (p. 52)
  • 3.2.1. General response (p. 56)
  • 3.2.2. The background (p. 58)
  • 4. Emissivity (p. 60)
  • 4.1. Conservation of energy (p. 60)
  • 4.2. Target emissivity (p. 61)
  • 4.3. Surface conditions (p. 63)
  • 4.4. Environmental effects (p. 63)
  • 4.5. Geometric factors (p. 65)
  • 4.6. Spectral dependence (p. 68)
  • 4.7. References (p. 73)
  • 5. Atmospheric Transmittance (p. 74)
  • 5.1. Extinction (p. 75)
  • 5.2. Path length dependence (p. 76)
  • 5.3. Atmospheric constituents (p. 79)
  • 5.3.1. Water vapor (p. 80)
  • 5.3.2. Aerosols (p. 81)
  • 5.4. Path radiance (p. 83)
  • 5.5. Modeling the atmosphere (p. 84)
  • 5.6. Back-of-the-envelope modeling (p. 85)
  • 5.6.1. "Average" weather conditions (p. 86)
  • 5.6.2. Range predictions (p. 87)
  • 5.7. References (p. 89)
  • 6. Camera Design (p. 90)
  • 6.1. Camera output (p. 92)
  • 6.2. System designs (p. 93)
  • 6.2.1. Military systems (p. 93)
  • 6.2.2. Civilian systems (p. 94)
  • 6.3. Optics (p. 94)
  • 6.4. Scanners (p. 95)
  • 6.5. Detectors and coolers (p. 97)
  • 6.5.1. Detector operation (p. 97)
  • 6.5.2. Specific detectors (p. 99)
  • 6.5.3. Detector responsivity (p. 100)
  • 6.5.4. Fixed pattern noise (p. 102)
  • 6.5.5. AC coupling (p. 102)
  • 6.5.6. Fill factor (p. 103)
  • 6.6. Digitization (p. 104)
  • 6.7. Image processing (p. 105)
  • 6.8. Reconstruction (p. 107)
  • 6.9. Monitors (p. 108)
  • 6.10. MWIR versus LWIR (p. 108)
  • 6.11. References (p. 109)
  • 7. Performance Parameters (p. 110)
  • 7.1. Spatial frequency (p. 113)
  • 7.2. Sensitivity (NEDT) (p. 114)
  • 7.2.1. NEDT measurement (p. 114)
  • 7.2.2. NEDT theory (p. 114)
  • 7.3. Spatial resolution (p. 117)
  • 7.3.1. Airy disk (p. 117)
  • 7.3.2. Instantaneous-field-of-view (p. 118)
  • 7.3.3. Pixel-angular-subtense (p. 119)
  • 7.3.4. Slit response function (p. 119)
  • 7.3.5. Measuring IFOV (p. 121)
  • 7.3.6. Nyquist frequency (p. 122)
  • 7.3.7. Optical zoom/electronic magnification (p. 123)
  • 7.4. Observer response (p. 125)
  • 7.5. MRT and MDT (p. 127)
  • 7.6. References (p. 129)
  • 8. Camera Selection (p. 130)
  • 8.1. Environment (p. 132)
  • 8.1.1. Harsh environment (p. 132)
  • 8.1.2. Ambient temperature (p. 133)
  • 8.1.3. Viewing geometry (p. 133)
  • 8.2. Camera (p. 139)
  • 8.2.1. Physical attributes (p. 139)
  • 8.2.2. Dynamic range (p. 139)
  • 8.2.3. Frame rate (p. 143)
  • 8.2.4. Image processing (p. 144)
  • 8.2.5. Calibration (p. 145)
  • 8.3. Storage and output (p. 145)
  • 8.4. Other issues (p. 146)
  • 8.5. References (p. 146)
  • 9. Observer Training (p. 147)
  • 9.1. Certification (p. 148)
  • 9.2. Military users (p. 149)
  • 9.3. MRT observers (p. 149)
  • 9.4. References (p. 150)
  • 10. Introduction to Applications (p. 151)
  • 10.1. Condition monitoring (p. 153)
  • 10.2. Process control/quality control (p. 155)
  • 11. Target Signatures (p. 157)
  • 11.1. Thermal anomaly identification (p. 157)
  • 11.2. The environment (p. 159)
  • 11.3. Passive targets (p. 163)
  • 11.3.1. Solar heating (p. 163)
  • 11.3.2. Clouds (p. 168)
  • 11.3.3. Wind (p. 168)
  • 11.3.4. Rain and snow (p. 169)
  • 11.3.5. The scanning window (p. 169)
  • 11.3.6. Outdoor considerations (p. 172)
  • 11.4. Emissivity variations (p. 173)
  • 11.5. Active targets (p. 176)
  • 11.5.1. Vehicles (p. 177)
  • 11.5.2. Small targets (p. 178)
  • 11.5.3. Estimate of the scanning window (p. 178)
  • 11.6. Limited access components (p. 181)
  • 11.7. References (p. 182)
  • 12. Temperature Measurements (p. 183)
  • 12.1. Apparent temperature (p. 183)
  • 12.2. Temperature calibration (p. 185)
  • 12.3. Emissivity (p. 187)
  • 12.3.1. Emissivity correction (p. 187)
  • 12.3.2. Angle of incidence (p. 188)
  • 12.3.3. Emissivity uncertainty (p. 190)
  • 12.3.4. Increasing the emissivity (p. 194)
  • 12.4. Measurement of T[subscript s] (p. 196)
  • 12.5. Atmospheric correction (p. 197)
  • 12.6. Dual band measurements (p. 197)
  • 12.7. Signal averaging (p. 198)
  • 12.8. References (p. 199)
  • 13. Building Envelope Inspection (p. 200)
  • 13.1. Building science (p. 201)
  • 13.1.1. Historic buildings (p. 201)
  • 13.1.2. 1880 to 1940 construction (p. 203)
  • 13.1.3. 1940 to 1960 construction (p. 203)
  • 13.1.4. 1960 to 1990 construction (p. 204)
  • 13.1.5. Modern construction (p. 204)
  • 13.1.6. Windows (p. 204)
  • 13.2. Heat transfer (p. 206)
  • 13.2.1. Conductivity (p. 207)
  • 13.2.2. Evaporation (p. 209)
  • 13.2.3. Mass transport (p. 210)
  • 13.3. Building inspection (p. 212)
  • 13.4. References (p. 212)
  • 14. Roof Inspection (p. 213)
  • 14.1. Roof construction (p. 215)
  • 14.2. Temperature differential (p. 216)
  • 14.2.1. Solar loading (p. 216)
  • 14.2.2. Clouds (p. 219)
  • 14.2.3. Wind (p. 220)
  • 14.2.4. Surface moisture (p. 220)
  • 14.2.5. High relative humidity (p. 220)
  • 14.2.6. Phase change (p. 221)
  • 14.2.7. Reflections (p. 221)
  • 14.2.8. Interior effects (p. 221)
  • 14.3. Inspections (p. 222)
  • 14.4. References (p. 224)
  • 15. Power Distribution (p. 225)
  • 15.1. Resistance (p. 226)
  • 15.2. Temperature (p. 230)
  • 15.2.1. Radiation (p. 231)
  • 15.2.2. Conduction (p. 232)
  • 15.2.3. Convection (p. 233)
  • 15.3. Power distribution inspection (p. 235)
  • 15.4. References (p. 238)
  • 16. Electrical/Mechanical Inspection (p. 239)
  • 16.1. Baseline thermogram (p. 240)
  • 16.2. Electrical connections (p. 240)
  • 16.3. Motors: electrical components (p. 243)
  • 16.4. Motors: mechanical components (p. 244)
  • 16.5. Machinery (p. 246)
  • 16.6. Emissivity (p. 250)
  • 16.7. Temperature guidelines (p. 251)
  • 16.7.1. Electrical circuits (p. 251)
  • 16.7.2. Mechanical systems (p. 254)
  • 16.8. References (p. 255)
  • 17. Buried Objects (p. 256)
  • 17.1. Heat transfer (p. 257)
  • 17.2. Environment (p. 260)
  • 17.3. Underground objects (p. 260)
  • 17.3.1. Hot fluids (p. 260)
  • 17.3.2. Voids (p. 264)
  • 17.4. References (p. 264)
  • 18. Surveillance (p. 265)
  • 18.1. Surveillance applications (p. 266)
  • 18.1.1. Law enforcement (p. 267)
  • 18.1.2. Search and rescue (p. 270)
  • 18.1.3. Air/space surveillance (p. 270)
  • 18.1.4. Animal monitoring (p. 273)
  • 18.1.5. Military (p. 274)
  • 18.2. Minimum resolvable temperature (MRT) (p. 276)
  • 18.2.1. Perceived signal-to-noise ratio (p. 276)
  • 18.2.2. Three-dimensional noise model (p. 278)
  • 18.2.3. Two-dimensional MRT (p. 280)
  • 18.3. Range predictions (p. 281)
  • 18.3.1. Target [Delta]T (p. 282)
  • 18.3.2. Johnson criteria (p. 283)
  • 18.3.3. Discrimination (p. 283)
  • 18.3.4. Target transfer probability function (p. 284)
  • 18.3.5. Range prediction methodology (p. 286)
  • 18.4. References (p. 290)
  • 19. Nondestructive Testing (p. 291)
  • 19.1. Applications (p. 293)
  • 19.2. Heat transfer (p. 295)
  • 19.2.1. Flash pulse (impulse or Dirac pulse) (p. 296)
  • 19.2.2. Step and square pulse irradiation (p. 298)
  • 19.2.3. Modulated irradiation (p. 300)
  • 19.3. Test methodology (p. 301)
  • 19.3.1. Heat injection methods (p. 302)
  • 19.3.2. Data analysis (p. 305)
  • 19.3.3. Temperature/time guidelines (p. 307)
  • 19.4. References (p. 309)
  • 20. Process/Quality Control (p. 310)
  • 20.1. Automotive (p. 311)
  • 20.2. Petrochemical (p. 311)
  • 20.3. Die castings and molding (p. 313)
  • 20.4. Printed circuit boards (p. 313)
  • 20.5. Metals (p. 315)
  • 20.5.1. Aluminum (p. 316)
  • 20.5.2. Steel (p. 317)
  • 20.6. Paper industry (p. 317)
  • 20.7. References (p. 318)
  • 21. Inspection Procedures (p. 319)
  • 21.1. Preliminary work (p. 320)
  • 21.1.1. Who (p. 320)
  • 21.1.2. What (p. 321)
  • 21.1.3. When (p. 321)
  • 21.1.4. Where (p. 322)
  • 21.1.5. Why (p. 322)
  • 21.1.6. How (p. 322)
  • 21.2. Safety (p. 323)
  • 21.3. Standards and guidelines (p. 323)
  • 21.4. Test procedure (p. 324)
  • 21.4.1. Test plan (p. 324)
  • 21.4.2. Good engineering practices (p. 327)
  • 21.5. Exit conference (p. 328)
  • 21.6. Final report (p. 328)
  • 21.7. References (p. 330)
  • Appendix A Temperature Conversion (p. 331)
  • Appendix B Emissivity (p. 336)
  • Appendix C Thermal Sensing and Imaging 1980-1999 (p. 343)
  • Index (p. 370)