MTU Library Catalogue

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Design guidelines for surface mount and fine pitch technology / Vern Solberg.

By: Solberg, Vern.
Material type: materialTypeLabelBookSeries: Electronic packaging and interconnection series.Publisher: New York : McGraw-Hill, 1996Edition: 2nd ed.Description: xvi, 261 p. : ill. ; 24 cm. + hbk.ISBN: 0070595771 .Subject(s): Printed circuits -- Design and construction | Surface mount technology | Fine pitch technologyDDC classification: 621.381531
Contents:
Planning for surface mount design -- Component selection for SMT -- Land pattern development for SMT -- Space planning and interface -- Layout guidelines for rigid circuits -- SMT layout and guidelines for flexible circuits -- Design requirements for fine-pitch devices -- Providing for test automation -- Specifying substrate materials and fabrication options -- SMT assembly process -- Aqueous cleaning for surface mount assemblies: Elimination of CFC materials from the SMT manufacturing environment -- Design evaluation for efficient assembly processing.
Holdings
Item type Current library Call number Copy number Status Barcode
General lending MTU Bishopstown Library Lending 621.381531 (Browse shelf(Opens below)) 1 Available 00074351
Total holds: 0

Enhanced descriptions from Syndetics:

Advances in surface mount technology have had a significant impact on the way in which electronic products are manufactured. Focusing on design for manufacturing surface mount PC boards, this text features recent breakthroughs in fine pitch and ball-grid-array devices. Step-by-step guidance for developing cost-effective products possible using SMT is also provided.

Includes index.

Planning for surface mount design -- Component selection for SMT -- Land pattern development for SMT -- Space planning and interface -- Layout guidelines for rigid circuits -- SMT layout and guidelines for flexible circuits -- Design requirements for fine-pitch devices -- Providing for test automation -- Specifying substrate materials and fabrication options -- SMT assembly process -- Aqueous cleaning for surface mount assemblies: Elimination of CFC materials from the SMT manufacturing environment -- Design evaluation for efficient assembly processing.