MTU Library Catalogue

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Photoacoustic and photothermal phenomena : proceedings of the 5th International Topical Meeting, Heidelberg, Fed. Rep. of Germany, July 27-30, 1987 / P. Hess, J. Pelzl (eds.).

By: (5th : International Topical Meeting on Photoacoustic and Photothermal Phenomena (5th : 1987 : University of Heidelberg).
Contributor(s): Hess, P. (Peter) | Pelzl, J. (Josef).
Material type: materialTypeLabelBookSeries: Springer series in optical sciences ; v. 58.Publisher: Berlin ; New York : Springer-Verlag, c1988Description: xix, 573 p. : ill. ; 24 cm.ISBN: 3540187820; 0387187820.Subject(s): Optoacoustic spectroscopy -- Congresses | Thermodynamics -- CongressesDDC classification: 621.361
Contents:
Part 1 Spectroscopy -- Part 2: Kinetics and relaxation -- Part 3: Trace analysis - Part 4: Surfaces and thin films -- Part 5: Applications to semiconductors -- Part 6: Ultrasonic detection and characterization -- Part 7: Mass and heat transfer -- Part 8: Thermal wave nondestructive evaluation -- Part 9: Experimental techniques -- Part 10: Biological and medical applications.

Enhanced descriptions from Syndetics:

photoacoustic and Photothermal Phenomena contains reviewsand a large numberof selected contributed papers reportingprogress in the application of new photoacoustic and photo-thermal techniques in physics, chemistry, biology, medicineand materials science. Theoretical and experimental work ispresented on spectroscopy, kinetics and relaxation, traceanalysis, mass and heat transport, surfaces and thin films,nondestructive evaluation,ultrasonics and semiconductors.

"Proceedings of the Fifth International Topical Meeting on Photoacoustic and Photothermal Phenomena ... held at the University of Heidelberg (FRG), July 27-30, 1987"--P. v.

Includes bibliographical references and index.

Part 1 Spectroscopy -- Part 2: Kinetics and relaxation -- Part 3: Trace analysis - Part 4: Surfaces and thin films -- Part 5: Applications to semiconductors -- Part 6: Ultrasonic detection and characterization -- Part 7: Mass and heat transfer -- Part 8: Thermal wave nondestructive evaluation -- Part 9: Experimental techniques -- Part 10: Biological and medical applications.