<?xml version="1.0" encoding="utf-8" ?> <rss version="2.0" xmlns:opensearch="http://a9.com/-/spec/opensearch/1.1/" xmlns:dc="http://purl.org/dc/elements/1.1/" xmlns:atom="http://www.w3.org/2005/Atom"> <channel> <title> <![CDATA[ Search for 'su:&quot;Packaging&quot;']]> </title> <link> https://libsearch.mtu.ie/cgi-bin/koha/opac-search.pl?q=ccl=su%3A%22Packaging%22&#38;sort_by=relevance&#38;format=rss </link> <atom:link rel="self" type="application/rss+xml" href="https://libsearch.mtu.ie/cgi-bin/koha/opac-search.pl?q=ccl=su%3A%22Packaging%22&#38;sort_by=relevance&#38;format=rss"/> <description> <![CDATA[ Search results for 'su:&quot;Packaging&quot;' at ]]> </description> <opensearch:totalResults>67</opensearch:totalResults> <opensearch:startIndex>0</opensearch:startIndex> <opensearch:itemsPerPage>50</opensearch:itemsPerPage> <atom:link rel="search" type="application/opensearchdescription+xml" href="https://libsearch.mtu.ie/cgi-bin/koha/opac-search.pl?q=ccl=su%3A%22Packaging%22&#38;sort_by=relevance&#38;format=opensearchdescription"/> <opensearch:Query role="request" searchTerms="q%3Dccl%3Dsu%253A%2522Packaging%2522" startPage="" /> <item> <title> Modern solder technology for competitive electronics manufacturing / </title> <dc:identifier>ISBN:0070317496 </dc:identifier> <link>https://libsearch.mtu.ie/cgi-bin/koha/opac-detail.pl?biblionumber=3004</link> <description> <![CDATA[ <img src="http://www.syndetics.com/index.aspx?isbn=0070317496/SC.GIF&#38;client=&#38;type=xw10" alt="" /> ]]> <![CDATA[ <p> By Hwang, Jennie S..<br /> New York : McGraw-Hill, 1996 .<br /> xliv, 622 p. : 24 cm. +.<br /> 0070317496 </p> ]]> <![CDATA[ <p> <a href="https://libsearch.mtu.ie/cgi-bin/koha/opac-reserve.pl?biblionumber=3004">Place hold on <em>Modern solder technology for competitive electronics manufacturing /</em></a> </p> ]]> </description> <guid>https://libsearch.mtu.ie/cgi-bin/koha/opac-detail.pl?biblionumber=3004</guid> </item> <item> <title> Packaging / </title> <dc:identifier>ISBN:1564961583</dc:identifier> <link>https://libsearch.mtu.ie/cgi-bin/koha/opac-detail.pl?biblionumber=3296</link> <description> <![CDATA[ <img src="http://www.syndetics.com/index.aspx?isbn=1564961583/SC.GIF&#38;client=&#38;type=xw10" alt="" /> ]]> <![CDATA[ <p> Rockport, MA : Rockport Publishers, 1995 .<br /> 79 p. : 31 cm. +.<br /> 1564961583 </p> ]]> <![CDATA[ <p> <a href="https://libsearch.mtu.ie/cgi-bin/koha/opac-reserve.pl?biblionumber=3296">Place hold on <em>Packaging /</em></a> </p> ]]> </description> <guid>https://libsearch.mtu.ie/cgi-bin/koha/opac-detail.pl?biblionumber=3296</guid> </item> <item> <title> Electronic packaging and interconnection handbook / </title> <dc:identifier>ISBN:0070266948 </dc:identifier> <link>https://libsearch.mtu.ie/cgi-bin/koha/opac-detail.pl?biblionumber=5185</link> <description> <![CDATA[ <img src="http://www.syndetics.com/index.aspx?isbn=0070266948/SC.GIF&#38;client=&#38;type=xw10" alt="" /> ]]> <![CDATA[ <p> New York : McGraw-Hill, 1997 .<br /> xii, various pagings : 24cm +.<br /> 0070266948 </p> ]]> <![CDATA[ <p> <a href="https://libsearch.mtu.ie/cgi-bin/koha/opac-reserve.pl?biblionumber=5185">Place hold on <em>Electronic packaging and interconnection handbook /</em></a> </p> ]]> </description> <guid>https://libsearch.mtu.ie/cgi-bin/koha/opac-detail.pl?biblionumber=5185</guid> </item> <item> <title> Materials for electronic packaging / </title> <dc:identifier>ISBN:0750693142</dc:identifier> <link>https://libsearch.mtu.ie/cgi-bin/koha/opac-detail.pl?biblionumber=5206</link> <description> <![CDATA[ <img src="http://www.syndetics.com/index.aspx?isbn=0750693142/SC.GIF&#38;client=&#38;type=xw10" alt="" /> ]]> <![CDATA[ <p> Boston : Butterworth-Heinemann, 1995 .<br /> xiv, 368 p. : 24 cm. +.<br /> 0750693142 </p> ]]> <![CDATA[ <p> <a href="https://libsearch.mtu.ie/cgi-bin/koha/opac-reserve.pl?biblionumber=5206">Place hold on <em>Materials for electronic packaging /</em></a> </p> ]]> </description> <guid>https://libsearch.mtu.ie/cgi-bin/koha/opac-detail.pl?biblionumber=5206</guid> </item> <item> <title> Semiconductor packaging : a multidisciplinary approach / </title> <dc:identifier>ISBN:0471181234 | 0471532991 </dc:identifier> <link>https://libsearch.mtu.ie/cgi-bin/koha/opac-detail.pl?biblionumber=5239</link> <description> <![CDATA[ <img src="http://www.syndetics.com/index.aspx?isbn=0471181234/SC.GIF&#38;client=&#38;type=xw10" alt="" /> ]]> <![CDATA[ <p> London ; | New York : Wiley-Interscience, 1997 .<br /> x, 887 p. ; 23 cm. +.<br /> 0471181234 | 0471532991 </p> ]]> <![CDATA[ <p> <a href="https://libsearch.mtu.ie/cgi-bin/koha/opac-reserve.pl?biblionumber=5239">Place hold on <em>Semiconductor packaging :</em></a> </p> ]]> </description> <guid>https://libsearch.mtu.ie/cgi-bin/koha/opac-detail.pl?biblionumber=5239</guid> </item> <item> <title> The Electronics assembly handbook / </title> <dc:identifier>ISBN:0948507411 | 3540194495 | 0387194495 </dc:identifier> <link>https://libsearch.mtu.ie/cgi-bin/koha/opac-detail.pl?biblionumber=6040</link> <description> <![CDATA[ <img src="http://www.syndetics.com/index.aspx?isbn=0948507411/SC.GIF&#38;client=&#38;type=xw10" alt="" /> ]]> <![CDATA[ <p> Bedford, U.K. : | Berlin ; | New York : IFS Publications ; | Springer-Verlag, 1988 .<br /> 603 p. : 26 cm..<br /> 0948507411 | 3540194495 | 0387194495 </p> ]]> <![CDATA[ <p> <a href="https://libsearch.mtu.ie/cgi-bin/koha/opac-reserve.pl?biblionumber=6040">Place hold on <em>The Electronics assembly handbook /</em></a> </p> ]]> </description> <guid>https://libsearch.mtu.ie/cgi-bin/koha/opac-detail.pl?biblionumber=6040</guid> </item> <item> <title> An introduction to digital prepress for flexography and packaging / </title> <dc:identifier>ISBN:</dc:identifier> <link>https://libsearch.mtu.ie/cgi-bin/koha/opac-detail.pl?biblionumber=7595</link> <description> <![CDATA[ <img src="http://www.syndetics.com/index.aspx?isbn=/SC.GIF&#38;client=corkinstinn&#38;type=xw10&#38;upc=&#38;oclc=" alt="" /> ]]> <![CDATA[ <p> Middlesex : Agfa-Gevaert, 1997 .<br /> 24 p. : , Includes index. 26 cm..<br /> </p> ]]> <![CDATA[ <p> <a href="https://libsearch.mtu.ie/cgi-bin/koha/opac-reserve.pl?biblionumber=7595">Place hold on <em>An introduction to digital prepress for flexography and packaging /</em></a> </p> ]]> </description> <guid>https://libsearch.mtu.ie/cgi-bin/koha/opac-detail.pl?biblionumber=7595</guid> </item> <item> <title> The Wiley encyclopedia of packaging technology / </title> <dc:identifier>ISBN:0471063975 </dc:identifier> <link>https://libsearch.mtu.ie/cgi-bin/koha/opac-detail.pl?biblionumber=8388</link> <description> <![CDATA[ <img src="http://www.syndetics.com/index.aspx?isbn=0471063975/SC.GIF&#38;client=&#38;type=xw10" alt="" /> ]]> <![CDATA[ <p> New York : Wiley, 1997 .<br /> xii, 1023 p. : , &quot;A Wiley-Interscience publication.&quot;. 29 cm. +.<br /> 0471063975 </p> ]]> <![CDATA[ <p> <a href="https://libsearch.mtu.ie/cgi-bin/koha/opac-reserve.pl?biblionumber=8388">Place hold on <em>The Wiley encyclopedia of packaging technology /</em></a> </p> ]]> </description> <guid>https://libsearch.mtu.ie/cgi-bin/koha/opac-detail.pl?biblionumber=8388</guid> </item> <item> <title> Flexible packaging of foods / </title> <dc:identifier>ISBN:0408701471</dc:identifier> <link>https://libsearch.mtu.ie/cgi-bin/koha/opac-detail.pl?biblionumber=15710</link> <description> <![CDATA[ <img src="http://www.syndetics.com/index.aspx?isbn=0408701471/SC.GIF&#38;client=&#38;type=xw10" alt="" /> ]]> <![CDATA[ <p> By Brody, Aaron L..<br /> London : Butterworths, 1970 .<br /> 103p : 28cm.<br /> 0408701471 </p> ]]> <![CDATA[ <p> <a href="https://libsearch.mtu.ie/cgi-bin/koha/opac-reserve.pl?biblionumber=15710">Place hold on <em>Flexible packaging of foods /</em></a> </p> ]]> </description> <guid>https://libsearch.mtu.ie/cgi-bin/koha/opac-detail.pl?biblionumber=15710</guid> </item> <item> <title> Package design : an introduction to the art of packaging / </title> <dc:identifier>ISBN:0136478425 | 0136478344 </dc:identifier> <link>https://libsearch.mtu.ie/cgi-bin/koha/opac-detail.pl?biblionumber=15794</link> <description> <![CDATA[ <img src="http://www.syndetics.com/index.aspx?isbn=0136478425/SC.GIF&#38;client=&#38;type=xw10" alt="" /> ]]> <![CDATA[ <p> By Roth, Lászlo..<br /> Englewood Cliffs, N.J. : Prentice-Hall, 1981 .<br /> xii, 212 p. : 28 cm..<br /> 0136478425 | 0136478344 </p> ]]> <![CDATA[ <p> <a href="https://libsearch.mtu.ie/cgi-bin/koha/opac-reserve.pl?biblionumber=15794">Place hold on <em>Package design :</em></a> </p> ]]> </description> <guid>https://libsearch.mtu.ie/cgi-bin/koha/opac-detail.pl?biblionumber=15794</guid> </item> <item> <title> The packaging designer's book of patterns / </title> <dc:identifier>ISBN:0471284114 </dc:identifier> <link>https://libsearch.mtu.ie/cgi-bin/koha/opac-detail.pl?biblionumber=18358</link> <description> <![CDATA[ <img src="http://www.syndetics.com/index.aspx?isbn=0471284114/SC.GIF&#38;client=&#38;type=xw10" alt="" /> ]]> <![CDATA[ <p> By Roth, Lászlo..<br /> Chichester : Wiley, 1991 .<br /> viii, 487 p. : 28 cm +.<br /> 0471284114 </p> ]]> <![CDATA[ <p> <a href="https://libsearch.mtu.ie/cgi-bin/koha/opac-reserve.pl?biblionumber=18358">Place hold on <em>The packaging designer's book of patterns /</em></a> </p> ]]> </description> <guid>https://libsearch.mtu.ie/cgi-bin/koha/opac-detail.pl?biblionumber=18358</guid> </item> <item> <title> Newnes electronics assembly pocket book / </title> <dc:identifier>ISBN:0750602228</dc:identifier> <link>https://libsearch.mtu.ie/cgi-bin/koha/opac-detail.pl?biblionumber=20114</link> <description> <![CDATA[ <img src="http://www.syndetics.com/index.aspx?isbn=0750602228/SC.GIF&#38;client=&#38;type=xw10" alt="" /> ]]> <![CDATA[ <p> By Brindley, Keith..<br /> Oxford : BH Newnes, 1991 .<br /> 298 p. : 20 cm..<br /> 0750602228 </p> ]]> <![CDATA[ <p> <a href="https://libsearch.mtu.ie/cgi-bin/koha/opac-reserve.pl?biblionumber=20114">Place hold on <em>Newnes electronics assembly pocket book /</em></a> </p> ]]> </description> <guid>https://libsearch.mtu.ie/cgi-bin/koha/opac-detail.pl?biblionumber=20114</guid> </item> <item> <title> Chip scale package (CSP) : design, materials, processes, reliability, and applications / </title> <dc:identifier>ISBN:0070383049</dc:identifier> <link>https://libsearch.mtu.ie/cgi-bin/koha/opac-detail.pl?biblionumber=20822</link> <description> <![CDATA[ <img src="http://www.syndetics.com/index.aspx?isbn=0070383049/SC.GIF&#38;client=&#38;type=xw10" alt="" /> ]]> <![CDATA[ <p> By Lau, John H..<br /> New York ; | London : McGraw-Hill, 1999 .<br /> xxii, 564 p. : 24 cm. +.<br /> 0070383049 </p> ]]> <![CDATA[ <p> <a href="https://libsearch.mtu.ie/cgi-bin/koha/opac-reserve.pl?biblionumber=20822">Place hold on <em>Chip scale package (CSP) :</em></a> </p> ]]> </description> <guid>https://libsearch.mtu.ie/cgi-bin/koha/opac-detail.pl?biblionumber=20822</guid> </item> <item> <title> Electronic packaging : design, materials, process, and reliability / </title> <dc:identifier>ISBN:0070371350</dc:identifier> <link>https://libsearch.mtu.ie/cgi-bin/koha/opac-detail.pl?biblionumber=20824</link> <description> <![CDATA[ <img src="http://www.syndetics.com/index.aspx?isbn=0070371350/SC.GIF&#38;client=&#38;type=xw10" alt="" /> ]]> <![CDATA[ <p> By Lau, John H..<br /> New York ; | London : McGraw-Hill, 1998 .<br /> xxiv, 498 p. : 24 cm. .<br /> 0070371350 </p> ]]> <![CDATA[ <p> <a href="https://libsearch.mtu.ie/cgi-bin/koha/opac-reserve.pl?biblionumber=20824">Place hold on <em>Electronic packaging :</em></a> </p> ]]> </description> <guid>https://libsearch.mtu.ie/cgi-bin/koha/opac-detail.pl?biblionumber=20824</guid> </item> <item> <title> Low cost flip chip technologies : for DCA, WLCSP, and PBGA assemblies / </title> <dc:identifier>ISBN:0071351418</dc:identifier> <link>https://libsearch.mtu.ie/cgi-bin/koha/opac-detail.pl?biblionumber=20830</link> <description> <![CDATA[ <img src="http://www.syndetics.com/index.aspx?isbn=0071351418/SC.GIF&#38;client=&#38;type=xw10" alt="" /> ]]> <![CDATA[ <p> By Lau, John H..<br /> New York ; | London : McGraw-Hill, 2000 .<br /> xxii, 585 p. : 24 cm. +.<br /> 0071351418 </p> ]]> <![CDATA[ <p> <a href="https://libsearch.mtu.ie/cgi-bin/koha/opac-reserve.pl?biblionumber=20830">Place hold on <em>Low cost flip chip technologies :</em></a> </p> ]]> </description> <guid>https://libsearch.mtu.ie/cgi-bin/koha/opac-detail.pl?biblionumber=20830</guid> </item> <item> <title> The handbook of machine soldering : SMT and TH / </title> <dc:identifier>ISBN:0471139041</dc:identifier> <link>https://libsearch.mtu.ie/cgi-bin/koha/opac-detail.pl?biblionumber=22091</link> <description> <![CDATA[ <img src="http://www.syndetics.com/index.aspx?isbn=0471139041/SC.GIF&#38;client=&#38;type=xw10" alt="" /> ]]> <![CDATA[ <p> By Woodgate, Ralph W.,.<br /> New York ; | Chichester : Wiley, 1996 .<br /> xv, 321 p. : , &quot;A Wiley-Interscience publication.&quot;. Includes index. 25 cm. +.<br /> 0471139041 </p> ]]> <![CDATA[ <p> <a href="https://libsearch.mtu.ie/cgi-bin/koha/opac-reserve.pl?biblionumber=22091">Place hold on <em>The handbook of machine soldering :</em></a> </p> ]]> </description> <guid>https://libsearch.mtu.ie/cgi-bin/koha/opac-detail.pl?biblionumber=22091</guid> </item> <item> <title> Electronic packaging : materials and their properties / </title> <dc:identifier>ISBN:0849396255</dc:identifier> <link>https://libsearch.mtu.ie/cgi-bin/koha/opac-detail.pl?biblionumber=22629</link> <description> <![CDATA[ <img src="http://www.syndetics.com/index.aspx?isbn=0849396255/SC.GIF&#38;client=&#38;type=xw10" alt="" /> ]]> <![CDATA[ <p> By Pecht, Michael.<br /> Boca Raton : CRC Press, 1999 .<br /> 114 p. : 25 cm. .<br /> 0849396255 </p> ]]> <![CDATA[ <p> <a href="https://libsearch.mtu.ie/cgi-bin/koha/opac-reserve.pl?biblionumber=22629">Place hold on <em>Electronic packaging :</em></a> </p> ]]> </description> <guid>https://libsearch.mtu.ie/cgi-bin/koha/opac-detail.pl?biblionumber=22629</guid> </item> <item> <title> Microelectronic packaging : a bibliography / </title> <dc:identifier>ISBN:0306651831</dc:identifier> <link>https://libsearch.mtu.ie/cgi-bin/koha/opac-detail.pl?biblionumber=24982</link> <description> <![CDATA[ <img src="http://www.syndetics.com/index.aspx?isbn=0306651831/SC.GIF&#38;client=&#38;type=xw10" alt="" /> ]]> <![CDATA[ <p> By Agajanian, A. H..<br /> New York : IFI/Plenum, 1979 .<br /> x, 243 p. ; 26 cm.<br /> 0306651831 </p> ]]> <![CDATA[ <p> <a href="https://libsearch.mtu.ie/cgi-bin/koha/opac-reserve.pl?biblionumber=24982">Place hold on <em>Microelectronic packaging :</em></a> </p> ]]> </description> <guid>https://libsearch.mtu.ie/cgi-bin/koha/opac-detail.pl?biblionumber=24982</guid> </item> <item> <title> Fundamentals of packaging technology / </title> <dc:identifier>ISBN:0946467005</dc:identifier> <link>https://libsearch.mtu.ie/cgi-bin/koha/opac-detail.pl?biblionumber=25627</link> <description> <![CDATA[ <img src="http://www.syndetics.com/index.aspx?isbn=0946467005/SC.GIF&#38;client=&#38;type=xw10" alt="" /> ]]> <![CDATA[ <p> By Soroka, W..<br /> Leicestershire : Institute of Packaging, 1996 .<br /> xii, 464 p. : , Revised UK edition. 28 cm..<br /> 0946467005 </p> ]]> <![CDATA[ <p> <a href="https://libsearch.mtu.ie/cgi-bin/koha/opac-reserve.pl?biblionumber=25627">Place hold on <em>Fundamentals of packaging technology /</em></a> </p> ]]> </description> <guid>https://libsearch.mtu.ie/cgi-bin/koha/opac-detail.pl?biblionumber=25627</guid> </item> <item> <title> How to wrap five more eggs : traditional Japanese packaging / </title> <dc:identifier>ISBN:0834801086 (hardback)</dc:identifier> <link>https://libsearch.mtu.ie/cgi-bin/koha/opac-detail.pl?biblionumber=26447</link> <description> <![CDATA[ <img src="http://www.syndetics.com/index.aspx?isbn=0834801086/SC.GIF&#38;client=&#38;type=xw10" alt="" /> ]]> <![CDATA[ <p> By Oka, Hideyuki,.<br /> .<br /> 216 pages : , Issued in conjunction with an exhibition held at the Japan House Gallery, New York, 1975-76. 27 cm.<br /> 0834801086 (hardback) </p> ]]> <![CDATA[ <p> <a href="https://libsearch.mtu.ie/cgi-bin/koha/opac-reserve.pl?biblionumber=26447">Place hold on <em>How to wrap five more eggs :</em></a> </p> ]]> </description> <guid>https://libsearch.mtu.ie/cgi-bin/koha/opac-detail.pl?biblionumber=26447</guid> </item> <item> <title> Food-processing machinery : including packaging techniques. </title> <dc:identifier>ISBN:9211165180</dc:identifier> <link>https://libsearch.mtu.ie/cgi-bin/koha/opac-detail.pl?biblionumber=28731</link> <description> <![CDATA[ <img src="http://www.syndetics.com/index.aspx?isbn=9211165180/SC.GIF&#38;client=&#38;type=xw10" alt="" /> ]]> <![CDATA[ <p> New York : United Nations, 1991 .<br /> xiv, 214 p. : , Cover title: Food-processing machinery. | At head of title: Economic Commission for Europe, Geneva. | &quot;ECE/ENG.AUT/43.&quot;. | &quot;United Nations publication sales no. E.91.II.E.30&quot;--T.p. verso. 30 cm..<br /> 9211165180 </p> ]]> <![CDATA[ <p> <a href="https://libsearch.mtu.ie/cgi-bin/koha/opac-reserve.pl?biblionumber=28731">Place hold on <em>Food-processing machinery :</em></a> </p> ]]> </description> <guid>https://libsearch.mtu.ie/cgi-bin/koha/opac-detail.pl?biblionumber=28731</guid> </item> <item> <title> Newnes electronics assembly handbook / </title> <dc:identifier>ISBN:075061630X</dc:identifier> <link>https://libsearch.mtu.ie/cgi-bin/koha/opac-detail.pl?biblionumber=29123</link> <description> <![CDATA[ <img src="http://www.syndetics.com/index.aspx?isbn=075061630X/SC.GIF&#38;client=&#38;type=xw10" alt="" /> ]]> <![CDATA[ <p> By Brindley, Keith..<br /> Oxford : Newnes, 1993 .<br /> 345 p. : 26 cm..<br /> 075061630X </p> ]]> <![CDATA[ <p> <a href="https://libsearch.mtu.ie/cgi-bin/koha/opac-reserve.pl?biblionumber=29123">Place hold on <em>Newnes electronics assembly handbook /</em></a> </p> ]]> </description> <guid>https://libsearch.mtu.ie/cgi-bin/koha/opac-detail.pl?biblionumber=29123</guid> </item> <item> <title> Structural package designs / </title> <dc:identifier>ISBN:9054960515</dc:identifier> <link>https://libsearch.mtu.ie/cgi-bin/koha/opac-detail.pl?biblionumber=33591</link> <description> <![CDATA[ <img src="http://www.syndetics.com/index.aspx?isbn=9054960515/SC.GIF&#38;client=&#38;type=xw10" alt="" /> ]]> <![CDATA[ <p> By Pathak, Haresh..<br /> Amsterdam and Singapore : The Pepin Press, 1998 .<br /> 368 p. : 15 cm. .<br /> 9054960515 </p> ]]> <![CDATA[ <p> <a href="https://libsearch.mtu.ie/cgi-bin/koha/opac-reserve.pl?biblionumber=33591">Place hold on <em>Structural package designs /</em></a> </p> ]]> </description> <guid>https://libsearch.mtu.ie/cgi-bin/koha/opac-detail.pl?biblionumber=33591</guid> </item> <item> <title> Reflow soldering processes : SMT, BGA, CSP, and flip chip technologies / </title> <dc:identifier>ISBN:0750672188 (alk. paper)</dc:identifier> <link>https://libsearch.mtu.ie/cgi-bin/koha/opac-detail.pl?biblionumber=42341</link> <description> <![CDATA[ <img src="http://www.syndetics.com/index.aspx?isbn=0750672188/SC.GIF&#38;client=&#38;type=xw10" alt="" /> ]]> <![CDATA[ <p> By Lee, Ning-Cheng..<br /> Boston, Mass. : Newnes, 2001 .<br /> 270 p. : 26 cm. +.<br /> 0750672188 (alk. paper) </p> ]]> <![CDATA[ <p> <a href="https://libsearch.mtu.ie/cgi-bin/koha/opac-reserve.pl?biblionumber=42341">Place hold on <em>Reflow soldering processes :</em></a> </p> ]]> </description> <guid>https://libsearch.mtu.ie/cgi-bin/koha/opac-detail.pl?biblionumber=42341</guid> </item> <item> <title> Area array packaging handbook / </title> <dc:identifier>ISBN:0071374930 (alk. paper)</dc:identifier> <link>https://libsearch.mtu.ie/cgi-bin/koha/opac-detail.pl?biblionumber=42342</link> <description> <![CDATA[ <img src="http://www.syndetics.com/index.aspx?isbn=0071374930/SC.GIF&#38;client=&#38;type=xw10" alt="" /> ]]> <![CDATA[ <p> By Gilleo, Ken..<br /> New York : McGraw-Hill, 2002 .<br /> 1 v. (various pagings) : 25 cm. +.<br /> 0071374930 (alk. paper) </p> ]]> <![CDATA[ <p> <a href="https://libsearch.mtu.ie/cgi-bin/koha/opac-reserve.pl?biblionumber=42342">Place hold on <em>Area array packaging handbook /</em></a> </p> ]]> </description> <guid>https://libsearch.mtu.ie/cgi-bin/koha/opac-detail.pl?biblionumber=42342</guid> </item> <item> <title> Twenty sixth IEEE/CPMT International Electronics Manufacturing Technology Sympoisum : proceedings of the 2000 IEMT Symposium held in Santa Clara California, October 2-3, 2000 / </title> <dc:identifier>ISBN:0780364821</dc:identifier> <link>https://libsearch.mtu.ie/cgi-bin/koha/opac-detail.pl?biblionumber=42347</link> <description> <![CDATA[ <img src="http://www.syndetics.com/index.aspx?isbn=0780364821/SC.GIF&#38;client=&#38;type=xw10" alt="" /> ]]> <![CDATA[ <p> Piscataway, NJ : IEEE, 2000 .<br /> v, 388 p. : , IEEE catalog number 00CH37146--T.p. verso. 28 cm. +.<br /> 0780364821 </p> ]]> <![CDATA[ <p> <a href="https://libsearch.mtu.ie/cgi-bin/koha/opac-reserve.pl?biblionumber=42347">Place hold on <em>Twenty sixth IEEE/CPMT International Electronics Manufacturing Technology Sympoisum :</em></a> </p> ]]> </description> <guid>https://libsearch.mtu.ie/cgi-bin/koha/opac-detail.pl?biblionumber=42347</guid> </item> <item> <title> Fundamentals of microfabrication : the science of miniaturization / </title> <dc:identifier>ISBN:0849308267 </dc:identifier> <link>https://libsearch.mtu.ie/cgi-bin/koha/opac-detail.pl?biblionumber=42359</link> <description> <![CDATA[ <img src="http://www.syndetics.com/index.aspx?isbn=0849308267/SC.GIF&#38;client=&#38;type=xw10" alt="" /> ]]> <![CDATA[ <p> By Madou, Marc J..<br /> Boca Raton, FL : CRC Press, 2001 .<br /> 723 p. : 29 cm. +.<br /> 0849308267 </p> ]]> <![CDATA[ <p> <a href="https://libsearch.mtu.ie/cgi-bin/koha/opac-reserve.pl?biblionumber=42359">Place hold on <em>Fundamentals of microfabrication :</em></a> </p> ]]> </description> <guid>https://libsearch.mtu.ie/cgi-bin/koha/opac-detail.pl?biblionumber=42359</guid> </item> <item> <title> RF measurements of die and packages / </title> <dc:identifier>ISBN:158053273X (alk. paper)</dc:identifier> <link>https://libsearch.mtu.ie/cgi-bin/koha/opac-detail.pl?biblionumber=43234</link> <description> <![CDATA[ <img src="http://www.syndetics.com/index.aspx?isbn=158053273X/SC.GIF&#38;client=&#38;type=xw10" alt="" /> ]]> <![CDATA[ <p> By Wartenberg, Scott A..<br /> Boston : Artech House, 2002 .<br /> xv, 224 p. : 24 cm. +.<br /> 158053273X (alk. paper) </p> ]]> <![CDATA[ <p> <a href="https://libsearch.mtu.ie/cgi-bin/koha/opac-reserve.pl?biblionumber=43234">Place hold on <em>RF measurements of die and packages /</em></a> </p> ]]> </description> <guid>https://libsearch.mtu.ie/cgi-bin/koha/opac-detail.pl?biblionumber=43234</guid> </item> <item> <title> 50 trade secrets of great design packaging / </title> <dc:identifier>ISBN:1564968723</dc:identifier> <link>https://libsearch.mtu.ie/cgi-bin/koha/opac-detail.pl?biblionumber=44217</link> <description> <![CDATA[ <img src="http://www.syndetics.com/index.aspx?isbn=1564968723/SC.GIF&#38;client=&#38;type=xw10" alt="" /> ]]> <![CDATA[ <p> By Cliff, Stafford..<br /> Massachusetts : Rockport Publishers Inc., 1999 .<br /> 224 p. : 30 cm. .<br /> 1564968723 </p> ]]> <![CDATA[ <p> <a href="https://libsearch.mtu.ie/cgi-bin/koha/opac-reserve.pl?biblionumber=44217">Place hold on <em>50 trade secrets of great design packaging /</em></a> </p> ]]> </description> <guid>https://libsearch.mtu.ie/cgi-bin/koha/opac-detail.pl?biblionumber=44217</guid> </item> <item> <title> Packaging graphics + design / </title> <dc:identifier>ISBN:1564968170</dc:identifier> <link>https://libsearch.mtu.ie/cgi-bin/koha/opac-detail.pl?biblionumber=44218</link> <description> <![CDATA[ <img src="http://www.syndetics.com/index.aspx?isbn=1564968170/SC.GIF&#38;client=&#38;type=xw10" alt="" /> ]]> <![CDATA[ <p> By Phillips, Renée..<br /> Massachusetts : Rockport Publishers Inc, 2001 .<br /> 188 p. : , Includes index. 28 cm..<br /> 1564968170 </p> ]]> <![CDATA[ <p> <a href="https://libsearch.mtu.ie/cgi-bin/koha/opac-reserve.pl?biblionumber=44218">Place hold on <em>Packaging graphics + design /</em></a> </p> ]]> </description> <guid>https://libsearch.mtu.ie/cgi-bin/koha/opac-detail.pl?biblionumber=44218</guid> </item> <item> <title> Shelf space : modern package design, 1945-1965 / </title> <dc:identifier>ISBN:0811817849 (pbk)</dc:identifier> <link>https://libsearch.mtu.ie/cgi-bin/koha/opac-detail.pl?biblionumber=46644</link> <description> <![CDATA[ <img src="http://www.syndetics.com/index.aspx?isbn=0811817849/SC.GIF&#38;client=&#38;type=xw10" alt="" /> ]]> <![CDATA[ <p> By Jankowski, Jerry..<br /> San Francisco, Calif. : Chronicle Books, 1998 .<br /> 119 p. : 21 x 22 cm. +.<br /> 0811817849 (pbk) </p> ]]> <![CDATA[ <p> <a href="https://libsearch.mtu.ie/cgi-bin/koha/opac-reserve.pl?biblionumber=46644">Place hold on <em>Shelf space :</em></a> </p> ]]> </description> <guid>https://libsearch.mtu.ie/cgi-bin/koha/opac-detail.pl?biblionumber=46644</guid> </item> <item> <title> Design secrets : packaging : 50 real-life projects uncovered / </title> <dc:identifier>ISBN:1592530060</dc:identifier> <link>https://libsearch.mtu.ie/cgi-bin/koha/opac-detail.pl?biblionumber=47688</link> <description> <![CDATA[ <img src="http://www.syndetics.com/index.aspx?isbn=1592530060/SC.GIF&#38;client=&#38;type=xw10" alt="" /> ]]> <![CDATA[ <p> By Fishel, Catharine M..<br /> Gloucester, Ma. : Rockport, 2003 .<br /> 207 p. : 30 cm. +.<br /> 1592530060 </p> ]]> <![CDATA[ <p> <a href="https://libsearch.mtu.ie/cgi-bin/koha/opac-reserve.pl?biblionumber=47688">Place hold on <em>Design secrets :</em></a> </p> ]]> </description> <guid>https://libsearch.mtu.ie/cgi-bin/koha/opac-detail.pl?biblionumber=47688</guid> </item> <item> <title> Eat me : successful, seductive food packaging design / </title> <dc:identifier>ISBN:288046773X</dc:identifier> <link>https://libsearch.mtu.ie/cgi-bin/koha/opac-detail.pl?biblionumber=49001</link> <description> <![CDATA[ <img src="http://www.syndetics.com/index.aspx?isbn=288046773X/SC.GIF&#38;client=&#38;type=xw10" alt="" /> ]]> <![CDATA[ <p> By Hargreaves, Ben..<br /> Switzerland : Rotovision, 2004 .<br /> 160 p. : , Includes index. 24 cm. .<br /> 288046773X </p> ]]> <![CDATA[ <p> <a href="https://libsearch.mtu.ie/cgi-bin/koha/opac-reserve.pl?biblionumber=49001">Place hold on <em>Eat me :</em></a> </p> ]]> </description> <guid>https://libsearch.mtu.ie/cgi-bin/koha/opac-detail.pl?biblionumber=49001</guid> </item> <item> <title> What is packaging design? / </title> <dc:identifier>ISBN:2880466180</dc:identifier> <link>https://libsearch.mtu.ie/cgi-bin/koha/opac-detail.pl?biblionumber=49015</link> <description> <![CDATA[ <img src="http://www.syndetics.com/index.aspx?isbn=2880466180/SC.GIF&#38;client=&#38;type=xw10" alt="" /> ]]> <![CDATA[ <p> By Calver, Giles..<br /> Crans-Près-Céligny ; | Hove : RotoVision, 2003 .<br /> 255 p. : , Title from cover. Includes index. 23 cm. +.<br /> 2880466180 </p> ]]> <![CDATA[ <p> <a href="https://libsearch.mtu.ie/cgi-bin/koha/opac-reserve.pl?biblionumber=49015">Place hold on <em>What is packaging design? /</em></a> </p> ]]> </description> <guid>https://libsearch.mtu.ie/cgi-bin/koha/opac-detail.pl?biblionumber=49015</guid> </item> <item> <title> This end up : original approaches to packaging design / </title> <dc:identifier>ISBN:2880466482 (hardback)</dc:identifier> <link>https://libsearch.mtu.ie/cgi-bin/koha/opac-detail.pl?biblionumber=51339</link> <description> <![CDATA[ <img src="http://www.syndetics.com/index.aspx?isbn=2880466482/SC.GIF&#38;client=&#38;type=xw10" alt="" /> ]]> <![CDATA[ <p> By Ambrose, Gavin,.<br /> .<br /> 159 pages : 30 cm.<br /> 2880466482 (hardback) </p> ]]> <![CDATA[ <p> <a href="https://libsearch.mtu.ie/cgi-bin/koha/opac-reserve.pl?biblionumber=51339">Place hold on <em>This end up :</em></a> </p> ]]> </description> <guid>https://libsearch.mtu.ie/cgi-bin/koha/opac-detail.pl?biblionumber=51339</guid> </item> <item> <title> Forms, folds, and sizes : all the details graphic designers need to know but can never find / </title> <dc:identifier>ISBN:1592530540 | 9781592530540</dc:identifier> <link>https://libsearch.mtu.ie/cgi-bin/koha/opac-detail.pl?biblionumber=51485</link> <description> <![CDATA[ <img src="http://www.syndetics.com/index.aspx?isbn=1592530540/SC.GIF&#38;client=&#38;type=xw10" alt="" /> ]]> <![CDATA[ <p> By Evans, Poppy,.<br /> Gloucester, MA : Rockport Publishers, 2004 .<br /> 264 p. : 22 cm. +.<br /> 1592530540 | 9781592530540 </p> ]]> <![CDATA[ <p> <a href="https://libsearch.mtu.ie/cgi-bin/koha/opac-reserve.pl?biblionumber=51485">Place hold on <em>Forms, folds, and sizes :</em></a> </p> ]]> </description> <guid>https://libsearch.mtu.ie/cgi-bin/koha/opac-detail.pl?biblionumber=51485</guid> </item> <item> <title> Medical device packaging handbook / </title> <dc:identifier>ISBN:0824701992 </dc:identifier> <link>https://libsearch.mtu.ie/cgi-bin/koha/opac-detail.pl?biblionumber=52769</link> <description> <![CDATA[ <img src="http://www.syndetics.com/index.aspx?isbn=0824701992/SC.GIF&#38;client=&#38;type=xw10" alt="" /> ]]> <![CDATA[ <p> New York : Marcel Dekker, 1998 .<br /> vii, 403 p. : 24 cm. +.<br /> 0824701992 </p> ]]> <![CDATA[ <p> <a href="https://libsearch.mtu.ie/cgi-bin/koha/opac-reserve.pl?biblionumber=52769">Place hold on <em>Medical device packaging handbook /</em></a> </p> ]]> </description> <guid>https://libsearch.mtu.ie/cgi-bin/koha/opac-detail.pl?biblionumber=52769</guid> </item> <item> <title> Visible music / </title> <dc:identifier>ISBN:4894440849</dc:identifier> <link>https://libsearch.mtu.ie/cgi-bin/koha/opac-detail.pl?biblionumber=54480</link> <description> <![CDATA[ <img src="http://www.syndetics.com/index.aspx?isbn=4894440849/SC.GIF&#38;client=&#38;type=xw10" alt="" /> ]]> <![CDATA[ <p> Corte Maderia, Calif. ; | [Great Britain] : Gingko Press, 2000 .<br /> 201 p. : 31 cm. +.<br /> 4894440849 </p> ]]> <![CDATA[ <p> <a href="https://libsearch.mtu.ie/cgi-bin/koha/opac-reserve.pl?biblionumber=54480">Place hold on <em>Visible music /</em></a> </p> ]]> </description> <guid>https://libsearch.mtu.ie/cgi-bin/koha/opac-detail.pl?biblionumber=54480</guid> </item> <item> <title> More packaging prototypes / </title> <dc:identifier>ISBN:2940361371 | 9782940361373</dc:identifier> <link>https://libsearch.mtu.ie/cgi-bin/koha/opac-detail.pl?biblionumber=60859</link> <description> <![CDATA[ <img src="http://www.syndetics.com/index.aspx?isbn=2940361371/SC.GIF&#38;client=&#38;type=xw10" alt="" /> ]]> <![CDATA[ <p> By Denison, Edward..<br /> Mies, Switzerland : RotoVision, 2006 .<br /> 159 p : 29 cm +.<br /> 2940361371 | 9782940361373 </p> ]]> <![CDATA[ <p> <a href="https://libsearch.mtu.ie/cgi-bin/koha/opac-reserve.pl?biblionumber=60859">Place hold on <em>More packaging prototypes /</em></a> </p> ]]> </description> <guid>https://libsearch.mtu.ie/cgi-bin/koha/opac-detail.pl?biblionumber=60859</guid> </item> <item> <title> Fantastic folders and exceptional envelopes : a designer's guide to custom carriers that open conversations and seal deals / </title> <dc:identifier>ISBN:159253175X </dc:identifier> <link>https://libsearch.mtu.ie/cgi-bin/koha/opac-detail.pl?biblionumber=61091</link> <description> <![CDATA[ <img src="http://www.syndetics.com/index.aspx?isbn=159253175X/SC.GIF&#38;client=&#38;type=xw10" alt="" /> ]]> <![CDATA[ <p> By Belyea, Patricia..<br /> Gloucester, Mass. : Rockport Publishers, 2005 .<br /> 160 p. : 28 cm. +.<br /> 159253175X </p> ]]> <![CDATA[ <p> <a href="https://libsearch.mtu.ie/cgi-bin/koha/opac-reserve.pl?biblionumber=61091">Place hold on <em>Fantastic folders and exceptional envelopes :</em></a> </p> ]]> </description> <guid>https://libsearch.mtu.ie/cgi-bin/koha/opac-detail.pl?biblionumber=61091</guid> </item> <item> <title> Handbook of package engineering / </title> <dc:identifier>ISBN:1566763061</dc:identifier> <link>https://libsearch.mtu.ie/cgi-bin/koha/opac-detail.pl?biblionumber=67645</link> <description> <![CDATA[ <img src="http://www.syndetics.com/index.aspx?isbn=1566763061/SC.GIF&#38;client=&#38;type=xw10" alt="" /> ]]> <![CDATA[ <p> By Hanlon, Joseph F..<br /> Boca Raton, Fl : CRC Press, 1998 .<br /> xvii, 698 p. : 24 cm. .<br /> 1566763061 </p> ]]> <![CDATA[ <p> <a href="https://libsearch.mtu.ie/cgi-bin/koha/opac-reserve.pl?biblionumber=67645">Place hold on <em>Handbook of package engineering /</em></a> </p> ]]> </description> <guid>https://libsearch.mtu.ie/cgi-bin/koha/opac-detail.pl?biblionumber=67645</guid> </item> <item> <title> Thermo-mechanical design of a 100 GHz MMIC power amplifier using flip chip technology / </title> <dc:identifier>ISBN:</dc:identifier> <link>https://libsearch.mtu.ie/cgi-bin/koha/opac-detail.pl?biblionumber=70504</link> <description> <![CDATA[ <img src="http://www.syndetics.com/index.aspx?isbn=/SC.GIF&#38;client=corkinstinn&#38;type=xw10&#38;upc=&#38;oclc=" alt="" /> ]]> <![CDATA[ <p> By Cremin, Sean..<br /> Cork : Cork Institute of Technology, 2007 .<br /> 152 p. : 30 cm. +.<br /> </p> ]]> <![CDATA[ <p> <a href="https://libsearch.mtu.ie/cgi-bin/koha/opac-reserve.pl?biblionumber=70504">Place hold on <em>Thermo-mechanical design of a 100 GHz MMIC power amplifier using flip chip technology /</em></a> </p> ]]> </description> <guid>https://libsearch.mtu.ie/cgi-bin/koha/opac-detail.pl?biblionumber=70504</guid> </item> <item> <title> MEMS packaging / </title> <dc:identifier>ISBN:0863413358 </dc:identifier> <link>https://libsearch.mtu.ie/cgi-bin/koha/opac-detail.pl?biblionumber=73361</link> <description> <![CDATA[ <img src="http://www.syndetics.com/index.aspx?isbn=0863413358/SC.GIF&#38;client=&#38;type=xw10" alt="" /> ]]> <![CDATA[ <p> London : INSPEC, 2004 .<br /> xxix, 275 p. : 26 cm. +.<br /> 0863413358 </p> ]]> <![CDATA[ <p> <a href="https://libsearch.mtu.ie/cgi-bin/koha/opac-reserve.pl?biblionumber=73361">Place hold on <em>MEMS packaging /</em></a> </p> ]]> </description> <guid>https://libsearch.mtu.ie/cgi-bin/koha/opac-detail.pl?biblionumber=73361</guid> </item> <item> <title> Package design now! / </title> <dc:identifier>ISBN:9783822840313 | 3822840319</dc:identifier> <link>https://libsearch.mtu.ie/cgi-bin/koha/opac-detail.pl?biblionumber=75598</link> <description> <![CDATA[ <img src="http://www.syndetics.com/index.aspx?isbn=3822840319/SC.GIF&#38;client=&#38;type=xw10&#38;oclc=ocm68263445" alt="" /> ]]> <![CDATA[ <p> By Kozak, Gisela.<br /> Hong Kong ; | Los Angeles : Taschen, 2008 .<br /> 414 p. : , Includes index. 26 cm. +.<br /> 9783822840313 | 3822840319 </p> ]]> <![CDATA[ <p> <a href="https://libsearch.mtu.ie/cgi-bin/koha/opac-reserve.pl?biblionumber=75598">Place hold on <em>Package design now! /</em></a> </p> ]]> </description> <guid>https://libsearch.mtu.ie/cgi-bin/koha/opac-detail.pl?biblionumber=75598</guid> </item> <item> <title> Food packaging technology/ </title> <dc:identifier>ISBN:1841272213 | 9781841272214</dc:identifier> <link>https://libsearch.mtu.ie/cgi-bin/koha/opac-detail.pl?biblionumber=77515</link> <description> <![CDATA[ <img src="http://www.syndetics.com/index.aspx?isbn=1841272213/SC.GIF&#38;client=&#38;type=xw10" alt="" /> ]]> <![CDATA[ <p> Oxford : | Boca Raton, FL : Blackwell ; | CRC, 2003 .<br /> xviii, 346 p. : 24 cm. +.<br /> 1841272213 | 9781841272214 </p> ]]> <![CDATA[ <p> <a href="https://libsearch.mtu.ie/cgi-bin/koha/opac-reserve.pl?biblionumber=77515">Place hold on <em>Food packaging technology/</em></a> </p> ]]> </description> <guid>https://libsearch.mtu.ie/cgi-bin/koha/opac-detail.pl?biblionumber=77515</guid> </item> <item> <title> How to wrap five eggs : traditional Japanese packaging / </title> <dc:identifier>ISBN:9781590306192 | 1590306198 </dc:identifier> <link>https://libsearch.mtu.ie/cgi-bin/koha/opac-detail.pl?biblionumber=77810</link> <description> <![CDATA[ <img src="http://www.syndetics.com/index.aspx?isbn=1590306198/SC.GIF&#38;client=&#38;type=xw10&#38;oclc=226966560" alt="" /> ]]> <![CDATA[ <p> By Oka, Hideyuki,.<br /> Boston : | [New York] : Weatherhill ; | Distributed in the U.S. by Random House, 2008 .<br /> 223 p. : , Previously published under title: How to wrap five more eggs. 26 cm. +.<br /> 9781590306192 | 1590306198 </p> ]]> <![CDATA[ <p> <a href="https://libsearch.mtu.ie/cgi-bin/koha/opac-reserve.pl?biblionumber=77810">Place hold on <em>How to wrap five eggs :</em></a> </p> ]]> </description> <guid>https://libsearch.mtu.ie/cgi-bin/koha/opac-detail.pl?biblionumber=77810</guid> </item> <item> <title> Smart packaging technologies for fast moving consumer goods / </title> <dc:identifier>ISBN:9780470028025 | 0470028025 </dc:identifier> <link>https://libsearch.mtu.ie/cgi-bin/koha/opac-detail.pl?biblionumber=78103</link> <description> <![CDATA[ <img src="http://www.syndetics.com/index.aspx?isbn=0470028025/SC.GIF&#38;client=&#38;type=xw10" alt="" /> ]]> <![CDATA[ <p> By Kerry, Joseph.<br /> Hoboken, N.J. : | Chichester : Wiley ; | John Wiley [distributor], 2008 .<br /> xvi, 340 p., [2] p. of plates : 25 cm. +.<br /> 9780470028025 | 0470028025 </p> ]]> <![CDATA[ <p> <a href="https://libsearch.mtu.ie/cgi-bin/koha/opac-reserve.pl?biblionumber=78103">Place hold on <em>Smart packaging technologies for fast moving consumer goods /</em></a> </p> ]]> </description> <guid>https://libsearch.mtu.ie/cgi-bin/koha/opac-detail.pl?biblionumber=78103</guid> </item> <item> <title> Cross-verified, combined methodologies for high frequency electrical characterisation of electronic packaging / </title> <dc:identifier>ISBN:</dc:identifier> <link>https://libsearch.mtu.ie/cgi-bin/koha/opac-detail.pl?biblionumber=78635</link> <description> <![CDATA[ <img src="http://www.syndetics.com/index.aspx?isbn=/SC.GIF&#38;client=corkinstinn&#38;type=xw10&#38;upc=&#38;oclc=" alt="" /> ]]> <![CDATA[ <p> By Mc Gibney, Eoin..<br /> Cork : Cork Institute of Technology, 2009 .<br /> 240 p. : 30 cm. +.<br /> </p> ]]> <![CDATA[ <p> <a href="https://libsearch.mtu.ie/cgi-bin/koha/opac-reserve.pl?biblionumber=78635">Place hold on <em>Cross-verified, combined methodologies for high frequency electrical characterisation of electronic packaging /</em></a> </p> ]]> </description> <guid>https://libsearch.mtu.ie/cgi-bin/koha/opac-detail.pl?biblionumber=78635</guid> </item> <item> <title> The little book of big packaging ideas / </title> <dc:identifier>ISBN:9781592533534</dc:identifier> <link>https://libsearch.mtu.ie/cgi-bin/koha/opac-detail.pl?biblionumber=81229</link> <description> <![CDATA[ <img src="http://www.syndetics.com/index.aspx?isbn=1592533531/SC.GIF&#38;client=&#38;type=xw10" alt="" /> ]]> <![CDATA[ <p> By Fishel, Catharine M..<br /> Gloucester, Mass. : Rockport, 2007 .<br /> 351 p. : 21 cm. +.<br /> 9781592533534 </p> ]]> <![CDATA[ <p> <a href="https://libsearch.mtu.ie/cgi-bin/koha/opac-reserve.pl?biblionumber=81229">Place hold on <em>The little book of big packaging ideas /</em></a> </p> ]]> </description> <guid>https://libsearch.mtu.ie/cgi-bin/koha/opac-detail.pl?biblionumber=81229</guid> </item> <item> <title> Introduction to system-on-package (SOP) : miniaturization of the entire system / </title> <dc:identifier>ISBN:0071459065 (hbk.) | 9780071459068 (hbk.)</dc:identifier> <link>https://libsearch.mtu.ie/cgi-bin/koha/opac-detail.pl?biblionumber=82407</link> <description> <![CDATA[ <img src="http://www.syndetics.com/index.aspx?isbn=0071459065/SC.GIF&#38;client=&#38;type=xw10&#38;oclc=ocn226291849" alt="" /> ]]> <![CDATA[ <p> By Tummala, Rao R.,.<br /> New York : McGraw-Hill, 2008 .<br /> xx, 785 p. : 25 cm. +.<br /> 0071459065 (hbk.) | 9780071459068 (hbk.) </p> ]]> <![CDATA[ <p> <a href="https://libsearch.mtu.ie/cgi-bin/koha/opac-reserve.pl?biblionumber=82407">Place hold on <em>Introduction to system-on-package (SOP) :</em></a> </p> ]]> </description> <guid>https://libsearch.mtu.ie/cgi-bin/koha/opac-detail.pl?biblionumber=82407</guid> </item> </channel> </rss>
