Results of search for 'su:"Packaging"'

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Modern solder technology for competitive electronics manufacturing / Jennie S. Hwang.

by Hwang, Jennie S.

Material type: book

Book; Format: print Publisher: New York : McGraw-Hill, 1996Availability: Items available for loan: MTU Bishopstown Library (2). Location(s): Lending 621.381046.

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Packaging / Rockport Publishers.

Material type: book

Book; Format: print Publisher: Rockport, MA : Rockport Publishers, 1995Availability: Items available for loan: MTU Bishopstown Library (1). Location(s): Store 688.8.

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Electronic packaging and interconnection handbook / edited by Charles A. Harper.

by Harper, Charles A.

Edition: 2nd ed.Material type: book

Book; Format: print Publisher: New York : McGraw-Hill, 1997Availability: Items available for loan: MTU Bishopstown Library (1). Location(s): Lending 621.381046.

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Materials for electronic packaging / edited by Deborah D.L. Chung.

by Chung, Deborah D. L.

Material type: book

Book; Format: print Publisher: Boston : Butterworth-Heinemann, 1995Availability: Items available for loan: MTU Bishopstown Library (1). Location(s): Lending 621.381046.

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Semiconductor packaging : a multidisciplinary approach / edited by Robert J. Hannermann, Allan D. Kraus and Michael Pecht.

by Hannermann, Robert J | Kraus, Allan D | Pecht, Michael.

Material type: book

Book; Format: print Publisher: London ; New York : Wiley-Interscience, 1997Availability: Items available for loan: MTU Bishopstown Library (1). Location(s): Lending 621.381046.

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The Electronics assembly handbook / edited by Frank Riley and the staff of Electronic packaging and production.

by Riley, Frank J.

Material type: book

Book Publisher: Bedford, U.K. : Berlin ; New York : IFS Publications ; Springer-Verlag, 1988Availability: Items available for loan: MTU Bishopstown Library (1). Location(s): Lending 621.3815.

An introduction to digital prepress for flexography and packaging / Agfa.

by Aktiengesellschaft fur̈ Anilinfabrikation.

Material type: book

Book; Format: print Publisher: Middlesex : Agfa-Gevaert, 1997Availability: Items available for loan: MTU Bishopstown Library (1). Location(s): Lending 688.8.

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The Wiley encyclopedia of packaging technology / edited by Aaron L. Brody and Kenneth S. Marsh.

by Marsh, Kenneth S.

Edition: 2nd ed.Material type: book

Book; Format: print Publisher: New York : Wiley, 1997Availability: Items available for reference: MTU Bishopstown Library [Call number: 688.803] (1). Location(s): Reference 688.803.

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Flexible packaging of foods / author, Aaron L. Brody.

by Brody, Aaron L.

Material type: book

Book Publisher: London : Butterworths, 1970Availability: Items available for loan: MTU Bishopstown Library (1). Location(s): Store 664.09.

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Package design : an introduction to the art of packaging / Laszlo Roth.

by Roth, Lászlo.

Material type: book

Book Publisher: Englewood Cliffs, N.J. : Prentice-Hall, 1981Availability: Items available for loan: MTU Crawford College of Art and Design Library (1). Location(s): Store 688.8.

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The packaging designer's book of patterns / Laszlo Roth and George L. Wybenga.

by Roth, Lászlo | Wybenga, George L.

Material type: book

Book; Format: print Publisher: Chichester : Wiley, 1991Availability: Items available for loan: MTU Bishopstown Library (1). Location(s): Lending 688.8.

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Newnes electronics assembly pocket book / Keith Brindley.

by Brindley, Keith.

Material type: book

Book Publisher: Oxford : BH Newnes, 1991Availability: Items available for loan: MTU Bishopstown Library (1). Location(s): Lending 621.3815.

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Chip scale package (CSP) : design, materials, processes, reliability, and applications / John H. Lau and Shi-Wei Ricky Lee.

by Lau, John H | Lee, Shi-Wei Ricky.

Material type: book

Book; Format: print Publisher: New York ; London : McGraw-Hill, c1999Availability: Items available for loan: MTU Bishopstown Library (1). Location(s): Lending 621.3815.

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Electronic packaging : design, materials, process, and reliability / John H. Lau ... [et al.].

by Lau, John H | Prince, John L, 1941- | Nakayama, Wataru.

Material type: book

Book; Format: print Publisher: New York ; London : McGraw-Hill, 1998Availability: Items available for loan: MTU Bishopstown Library (1). Location(s): Lending 621.381046.

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Low cost flip chip technologies : for DCA, WLCSP, and PBGA assemblies / John H. Lau.

by Lau, John H.

Material type: book

Book; Format: print Publisher: New York ; London : McGraw-Hill, 2000Availability: Items available for loan: MTU Bishopstown Library (1). Location(s): Lending 621.3815.

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The handbook of machine soldering : SMT and TH / Ralph W. Woodgate.

by Woodgate, Ralph W, 1922-.

Edition: 3rd ed.Material type: book

Book; Format: print Publisher: New York ; Chichester : Wiley, 1996Availability: Items available for loan: MTU Bishopstown Library (1). Location(s): Lending 621.381046.

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Electronic packaging : materials and their properties / Michael G. Pecht ... [et al.].

by Pecht, Michael.

Material type: book

Book; Format: print Publisher: Boca Raton : CRC Press, 1999Availability: Items available for loan: MTU Bishopstown Library (1). Location(s): Lending 621.381046.

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Microelectronic packaging : a bibliography / compiled by A. H. Agajanian.

by Agajanian, A. H.

Material type: book

Book Publisher: New York : IFI/Plenum, c1979Availability: Items available for loan: MTU Bishopstown Library (1). Location(s): Store 621.381.

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Fundamentals of packaging technology / Walter Soroka, Anne Emblem and Henry Emblem.

by Soroka, W | Emblem, Anne | Emblem, Henry.

Material type: book

Book; Format: print Publisher: Leicestershire : Institute of Packaging, 1996Availability: Items available for loan: MTU Bishopstown Library (2). Location(s): Store 688.8.

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How to wrap five more eggs : traditional Japanese packaging / Hideyuki Oka.

by Oka, Hideyuki, 1905-1995 [author].

Material type: book

Book; Literary form: Not fiction Publisher: New York : Weatherhill, 1975Availability: Items available for loan: MTU Crawford College of Art and Design Library (1). Location(s): Lending 745.54.

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